TM120
Miniature 120×90 VOx Uncooled Thermal Module
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Product Description
TM120 is one of the TM series miniature infrared modules developed by ChengJing. It integrates optical lens, 120x90/17μm wafer level package (WLP) detector and basic image processing circuit to quickly obtain thermal images of the target area and heat distribution.
TM120 thermal imaging core is oriented for small size, light weight & low price (SWaP) infrared imaging applications. Its super miniature structure and ultralow power consumption are convenient to be integrated into various smart devices, thermal imagers or mobile terminals with strict requirements on cost, size and weight.
Now TM series thermal cores and modules have been widely used in consumer electronics market. It's easier for TIMO thermal camera core module to be integrated into more terminal products and greatly reduces the cost of customers.
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Contact SalesMain Features
Minimum WLP Module
Minimum WLP infrared module; size 8.5mm×8.5mm×9.16mm
DVP Interface
DVP Interface, compatible with various embedded platforms
Direct Integration
Visible camera module equivalent for directly integration
SDK Support
Provide software development kit
Ultra-low Power
Ultra-low power consumption, as low as 10mW
Specifications
| Parameter | Value |
|---|---|
| Sensitive Material | Vanadium Oxide |
| Resolution | 120×90 |
| Pixel Size | 17μm |
| Spectral Range | 8~14μm |
| NETD | ≤60mK |
| Frame Rate | 25Hz |
| Size (mm) | 8.5×8.5×9.16 |
| Power Consumption | As low as 10mW |
| Interface | DVP |
| Operating Temperature | -20℃~+60℃ |
| Storage Temperature | -40℃~+85℃ |
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