COIN417G2
LH Series 384×288/17μm WLP Thermal Module Gen2
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Product Description
LH417 uncooled infrared module is a new generation version of LH417 developed by ChengJing. It integrates 384x288/17μm wafer level package (WLP) infrared imaging detector, high performance signal processing circuit and image processing algorithm.
The LH417 infrared module features in sharp and crisp thermal image presentation, compact size and low cost. It also has an optional thermographic function with measurement range from -20℃~550 ℃ for industrial temperature measurement.
Until now, we have provided our customers with various mature and stable infrared thermal imaging solutions. It's easier for LH series thermal imaging common module to be integrated into more terminal products and greatly reduces the cost for customers.
Main Features
Outstanding Performance
Powerful image process algorithm: NUC/3DNR/DNS/DRC/EE
Temperature Measurement
With range of -20℃～150℃, 0~550℃ (support customization & expansion)
Fast Start-up
With start-up time at 3s and power consumption as low as 0.75W
Faster Integration
Support USB2.0/DVP/LVDS image output interfaces, RAW/YUV image data output, serial port control
Specifications
| Parameter | Value |
|---|---|
| Model | LH417 |
| Sensitive Material | Vanadium Oxide |
| Resolution | 384×288 |
| Pixel Size | 17μm |
| Spectral Range | 8μm~14μm |
| Typical NETD | ≤40mK |
| Frame Rate | 25Hz/30Hz |
| Start-up Time | 3s |
| Digital Video | RAW/YUV/BT656 |
| Digital Video Interface | USB2.0/DVP/LVDS |
| Supply Voltage | 4~5.5V |
| Typical Power Consumption | 0.75W |
| Temperature Measurement Range | -20℃~150℃, 0℃~550℃ |
| Operating Temperature | -40°C~+70°C |
| Storage Temperature | -45°C~+85°C |
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